INFORMATION

Conference Name: 2023 The 3rd International Conference on Mechanical Engineering and Applied Mechanics

Conference Time: 23-24 September, 2023

Submission Due: 20 September, 2023

Conference Venue: Dalian, China(Online)

ABOUT ICMEAM2023

2023 The 3rd International Conference on Mechanical Engineering and Applied Mechanics (ICMEAM2023) will be held at 23-24 September, 2023 in Dalian, China(Online). The Conference looks for significant contributions to all major fields of Internet of Mechanical Engineering and Applied Mechanics in theoretical and practical aspects. The aim of the conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.

CONFERENCE COMMITTEE

Guest Editor

Dr. Haijing Wang, School of Information and Electronic Engineering, Zhejiang University of Science and Technology, Hangzhou, China

Technical Committee Members

Prof. Ji Wang, Piezoelectric Device Laboratory, School of Mechanical Engineering and Mechanics, Ningbo University, China

Prof. Dr. habil.ing. Genādijs MOSKVINS, State Professor, specialty "Intelligent systems and technologies", Institute of Energetics ( IE), Faculty of Engineering (FE), Latvia University of Life Sciences & Technologies (LULST)

Prof. Shouchen Ma, School of Surveying and Land Information Engineering, Henan Polytechnic University

Dr. Ranying Sun, Zhejiang Univeristy of Technology, Hangzhou, China

Dr. Debabrata Singh, Department of CSIT, ITER, SOA(Deemed to be University), BBSR, ORISSA

Dr. Zul-Atfi Ismail, School of Environmental Engineering, Universiti Malaysia Perlis, Malaysia

Dr. Xiaolin Wang, University of Tasmania, Hobart, Australia

Dr. Dalin Zhang, University of New South Wales, Sydney, Australia

Dr. S. Sathish, Department of Mechanical Engineering, Hindustan University, Padur, Chennai, India

Dr. Hacene Mellah, Department of Electrical Engineering, Faculty of Technology, Hassiba Benbouali University of Chlef, Algeria

Dr. Ved Pal Singh, Maharshi Dayanand University, Rohtak, India

Dr. Vijayan Gurumurthy Iyer, Entrepreneurship Development Institute of India, India

Dr. Marcelo V. Garcia, Technical University of Ambato, Ambato, Ecuador

Dr. Gang Zhang, Institute of High Performance Computing, A*STAR, Singapore

Dr. Carmen Alexandrache, Faculty of Generale Sciences, Dunarea de Jos University of Galati, Galati, Romania

Dr. Sara Teidj, Faculty of Science and Technology, Moulay Ismail University of Meknes, Morocco

Dr. Victor Koledov, Department of Research and Development, Innowledgement GmbH, Castrop Rauxel, Germany

Dr. Svetlana von Gratowski, Department of Research and Development, Innowledgement GmbH, Castrop Rauxel, Germany

CALL FOR PAPERS

1)Mechanical Engineering: Mechanical Manufacturing, Vehicle Engineering, Automation, Mechanical And Electronic Engineering, Mechanical Design And Theory, Mechatronics, Manufacturing Automation/Measurement And Control Technology, Industrial Design, Microelectromechanical System Engineering, Mechanical Artificial Intelligence

2)Structural Mechanics: Structural Analysis, Structural Statics, Structural Dynamics, Structural Stability Theory, Structural Fracture And Fatigue Theory, Nanostructures, Structures And Materials, Structures And Models

3)Materials Science: Mechanics of Materials, Advanced Materials, Functional Materials, Metal Materials, Composites, Nanomaterials and Their Applications, Biomaterials, Material Forming And Control Engineering

4)And Other Related Areas

PUBLICATION
Accepted papers will be published in the conference proceedings. All manuscripts are submitted as full papers and are reviewed based on their scientific merit. The reviewing process is confidential. All paper submissions will be carefully reviewed by TPC experts and reviews will be returned to the author(s) with comments to ensure the high quality of the accepted papers. The accepted papers must be revised, taking into consideration the referees' comments and suggestions, before inclusion in the conference proceedings.

REGISTRATION

Each Registration fee (VAT inclusive) will include:

Entrance to the conference

Publish one full paper(unavailable for listeners)

One hard copy(unavailable for listeners)

Invitation Letter

Acceptance Notification

Conference Manual

Certificate(Listener/Speaker)

Conference Souvenir

**Note: The mailing costs will at your own expense.

PROGRAMS

CONTACT US

Yaseen Academy

Telephone: 027-86770006

WeChat: 17762404684

E-mail: contact@yaseen.org.cn

Submit online: www.yasen.org.cn